New Delhi: Microsoft has recently developed an liquid that can be injected into the semiconductor chips that will cool the graphic processing unit in short we know this as GPU, and it will cool as much as 65%, by which the health of these semiconductor will be improved and works smoothly without any data leak and other issues that cause after overheating, this liquid is going to protect those chips highly. Most of the GPUs in contemporary data centres use cool plates to cool the chips. Microsoft has successfully tested the latest cooling system that will remove heat up to three times better than the cold plates.
The cost of building and operating those data centres is measured in terms of the power required to run them and, therefore, expressed generally in kilowatts, megawatts, gigawatts and so on. Electrical systems account for 40-45% of the cost, according to some sources. Microsoft has also stated it hopes to use this latest fluid for the next generation of AI chips, but it has stopped short of giving a timeline for the implementation. It will also continue to work with the fabrication and the silicon partners to bring microfluidics into the production across its datacenters.
The Redmond-based tech giant, Washington, stated it will set aside $4 billion to build a new data centre in Wisconsin, where the company is already building one, likely to start operations in 2026, at a cost of $3.3 billion. If the GPU can be cooled quickly, it can also be stretched to a greater limit during times of increased demand, leading to more efficiency. Instead of using more chips, the company could overclock one for a few minutes. Along with this development, there is bad news for the companies that make cooling solutions for the data centres. The NYSE-listed Vertiv fell over 6% in trade after Microsoft’s announcement.
