Izmo Microsystems designs a compact, PCB-based camera component through indigenous 3D 3D SiP methods

Izmo Microsystems designs a compact, PCB-based camera component through indigenous 3D 3D SiP methods

Bengaluru: Izmo Ltd’s subsidiary, Izmo Microsystems, has achieved a breakthrough in semiconductor design by compacting the Printed Circuit Board (PCB) of a camera component by 84%, using highly advanced dense wire bonding.

Designed for use in commercial space applications, this technology is currently held only by a select group of global Tier 1 aerospace firms. The Bengaluru-based company achieved this through integrating active components in bare-die form onto a stacked substrate configuration. Using a fully indigenised Hermatic Ceramic Package, this solution is aimed at meeting the highly demanding thermal and vacuum conditions for long-term space missions.

This highly complex 3D System-in-Package(SiP) module has reduced the size of the component from 200mm x 200mm to 81mm x 81mm.

“The successful realization of this 3D SiP module validates our technical roadmap and our ability to execute on highly complex semiconductor packaging requirements. By migrating space electronics to integrated 3D architectures, we provide a viable solution for the ‘NewSpace’ industry where mass and volume reduction are critical factors. This achievement confirms our end-to-end competency in space-grade miniaturization and our commitment to building high-value intellectual property within India.” Dinanath Soni, Executive Director of izmo Microsystems Pvt. Ltd, said in a press release.

As one of India’s leading players in the semiconductor designing and packaging space, Izmo Ltd works with leading OEMs across healthcare, automotive, telecom, industrial, and aerospace companies to offer them customized SiP modules. The company, with a market cap of more than Rs.1,000 crore, is aiming to expand further in the global semiconductor industry, aiming to make a mark in the $10 billion SiP module market with its indigenously developed solutions. The company has consistently invested about 3-10% of its revenues in R&D since 2021, aiming to boost indigenization in the semiconductor space, in line with the government’s Make In India and Aatmanirbhar Bharat initiatives. 

The company’s shares were trading at Rs.716 following the news on January 12.

Disclaimer: This article is for informational purposes only and does not constitute financial advice. Readers should conduct their own research or consult with a qualified financial advisor before making any investment decisions.

Abizar Attari
Assistant Editor

I’ve always had a fascination with storytelling. Analyzing diverse perspectives and helping people understanding them simply is my life’s motto. I live to create stories that you’d love to read. When I’m not writing, you'll find me having a leisurely stroll on the beach or in the park.

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