New Delhi: Before the Samsung Unpacked event, Samsung unveiled its latest Exynos 2500 chipset, a flagship mobile processor designed to enhance performance and AI capabilities in premium smartphones. This chipset, built on a 3nm Gate-all-around process, is expected to be featured in the upcoming Galaxy Z Flip and other future Galaxy phones.
Samsung utilised its 3nm Gate-all-around manufacturing process for the latest SoC. This newest method not only makes the Exynos 2500 physically smaller but also enhances its power efficiency and heat dissipation. All this latest technology makes the new chip notably more efficient and powerful than its predecessor, the Exynos 2400.
This Exynos 2500 features a deca-core CPU arranged in a quad-cluster configuration. This includes one prime core, Cortex X925, clocked at 3.3 GHz for heavy lifting. The rest include two Cortex-A725 at 2.76 GHz, five Cortex-A725 at 2.35 GHz, and two Cortex-A520 at 1.8 GHz.
This last setup delivers a 15% increase in performance over the previous generation. The GPU is Xclipse 950, which is built on AMD’s RDNA 3 architecture. With 8 workgroup processors and 8 Render Backends, this GPU offers a 28% boost in frame rates and hardware-accelerated ray tracing. This is a significant improvement over the Exynos 2400 in gaming and other GPU-based workloads.
Samsung has added a powerful Neural Processing Unit in the Exynos 2500 to enable on-device AI features. This latest NPU is capable of 59 trillion operations per second, a significant improvement over the Exynos 2400. On the imaging front, the Exynos 2500 supports up to 320 MP camera sensors with 8K video recording at 30fps. It also features multi-layer noise reduction and Dynamic Range Compression for sharper photos and videos.
Samsung future-proofed the Exynos 2500 with the su[support for Wi-FI 7, Bluetooth 5.4, 5G, and satellite-based messaging. This chip also supports LPDDR5X RAM and faster UFS 4.1 storage, enabling seamless multitasking and enhanced data processing.
