Hyderabad: MosChip Technologies has delivered a custom-designed system on a chip (SoC) to the ISRO’s Space Application Centre (SAC), as the company announced in a press release. The SoC, made in the 28nm technology mode, marks the completion of its end-to-end turnkey ASIC program from Netlist to packaged silicon. To meet ISRO’s highly demanding technical requirements, MosChip designed the 10 Layer FC-CBGA package on ATE, confirming its functionality against the specified requirements.
This project exemplifies MosChip’s integrated Turnkey capacities as the company managed every critical phase- DFT architecture, implementation, verification, design and testing, itself. This has cemented MosChip’s status as a leading partner to global enterprises and innovators, where it has been collaborating with them for over 25 years in chip design, hardware engineering and embedded software development, amongst others.
“We are proud to have delivered this criƟcal program. This milestone validates MosChip’s turnkey Netlist-to-Silicon capability and our commitment to single-owner accountability from design intent to validated silicon. By unifying design, implementation, packaging, and ATE validation, we help customers move from Spec/RTL to silicon with predictable schedules and first-pass silicon success,” Srinivasa Rao Kakumanu, CEO & MD, MosChip Technologies, said.
MosChip is also working on other projects for ISRO, including advanced Application-Specific Integrated Circuits (ASICs) for space-grade data acquisition, with deliveries expected later this year .For ISRO, Moschip has emerged as a reliable and certified partner for its various designing and advanced engineering requirements.
