New Delhi: RRP Electronics Limited, a leading player in the semiconductor industry and backed by cricket legend Sachin Tendulkar, has entered into a strategic alliance with US-based Deca Technologies, Inc. (Deca), to enhance its semiconductor capabilities. Under the alliance, RRP Electronics – a firm focused on assembling and testing semiconductor components – will utilize Deca’s cutting-edge wafer-level packaging solutions to enhance its semiconductor capabilities. RRP will integrate Deca’s WLCSP and M-Series™ FOWLP technologies with the company’s assembly and testing processes. Deca, a leading technology development and licensing company in the advanced packaging industry, is backed by major industry investors such as Qualcomm, Infineon, and ASE Group.
Currently, RRP is collaborating on a high-profile project for a Swiss customer, focused on the production of sophisticated ASICs in QFN packages, further demonstrating a commitment to excellence and innovation in the electronics sector.
Commenting on the alliance, Rajendra K Chodankar, Chairman and CEO, of RRP Electronics said, “We are prepared to invest in a large-scale Technology Transfer License Agreement (TTLA) with potential exclusive terms for the complete automated infrastructure and take this alliance beyond horizons. The present infrastructure will also significantly contribute to the Deca ecosystem. We envisage the setup of functional operations after a qualification test in August 2025. This collaboration has the potential to generate revenue of over USD 30 million (about ₹260 crore) in the second year of operation, with quantum jumps in subsequent years.”
Tim Olson, Founder and CEO of Deca said, “We are excited to be an integral part of India’s exciting journey to become a prominent player in the growing global semiconductor industry. I am deeply impressed by the focus of the RRP Electronics team and believe that the relationship with Deca will accelerate their ambitious plans.”
RRP Electronics is developing an Outsourced Semiconductor Assembly and Test (OSAT) initiative with a total investment of ₹24,000 crore. The OSAT initiative aims to establish a state-of-the-art semiconductor manufacturing and assembly facility in Maharashtra. RRP Electronics is being supported by the Government of Maharashtra to foster technological advancements and economic growth in the region. In September 2024, RRP inaugurated its cutting-edge facility featuring the latest in advanced manufacturing equipment. This project is expected to create about 4,000 jobs, contributing significantly to the local economy and positioning Maharashtra as a key player in the global semiconductor market.
About RRP Electronics:
RRP Electronics Ltd. stands at the forefront of cutting-edge packaging technologies, offering innovative solutions in semiconductor packaging. With a dedication to excellence, sustainability, and continuous advancement, RRP Electronics is committed to meeting the ever-evolving needs of the electronics sector. The company’s focus on providing high-performance and reliable packaging solutions positions it as a leader in propelling the technology landscape forward.
About Deca Technologies
Deca is the leading independent provider of advanced packaging technology to the semiconductor industry backed by industry-leading investors including Infineon, Qualcomm, and ASE Group. Deca has a growing list of industry-leading partners working on technology transfer and license agreements to gain access to the proven structures, processes, materials, equipment, design systems, and know-how of the industry’s #1 volume fan-out technology. Starting with the highest quality and reliability in Gen 1 aimed at smartphone applications, and moving on to the growth of Gen 2 for chipsets and heterogeneous integration, Deca’s technologies are emerging as key industry standards for the future.
For more information, visit www.thinkdeca.com.
